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1 deep trench isolation
Микроэлектроника: глубокая шелевая изоляция -
2 deep trench isolation
ізоляція глибокими канавками, заповненими діелектриком, глибока щілинна ізоляціяEnglish-Ukrainian dictionary of microelectronics > deep trench isolation
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3 isolation
1) ізоляція 2) рідк. ізолююча область - air-охide isolation
- base-diffusion isolation
- ceramic isolation
- collector-diffusion isolation
- deep охide isolation
- deep trench isolation
- device isolation
- dielectric isolation
- diffused-junctionisolation
- diffusedisolation
- diode-typeisolation
- diodeisolation
- double-polysiliconisolation
- double-polyisolation
- epitaxial isolation
- etch-out and backfill isolation
- fully-enclosed air isolation
- glass isolation
- groove isolation
- half-sunk isolation
- interdevice isolation
- ion-implanted охide isolation
- isoplanar isolation
- junction isolation
- lateral isolation
- local-охide isolation
- mesa isolation
- oxide isolation
- passive isolation
- p-i-n isolation
- polycrystal isolation
- post fabrication isolation
- proton bombardment isolation
- proton isolation
- recessed dielectric isolation
- resistive isolation
- reverse-biased junction isolation
- reverse-biased isolation
- semirecessed oxide isolation
- sidewall masked isolation
- source-drain isolation
- standard buried collector isolation
- V-groove isolationEnglish-Ukrainian dictionary of microelectronics > isolation
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4 trench
1) ров
2) котлован
3) траншея
4) траншейный
5) высечка
6) канава
– deep trench
– explorating trench
– exploratory trench
– gutter trench
– permanent trench
– silage trench
– trench isolation
– working trench
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5 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
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6 mask
1. ім.1) фотошаблон; шаблон; (вільна) маска; трафарет2) маска, маскуючий шар2. дієсл. маскувати - artwork mask
- base-region mask
- base mask
- base-resistor mask
- bimetal mask
- blocking mask
- chrome mask
- collector mask
- composite mask
- contact-area mask
- contact mask
- contact-print additional mask
- custom mask
- deep UV mask
- delineation mask
- deposition mask
- diffusion mask
- doping mask
- dry film solder mask
- E-beam mask
- E-chrome mask
- electron-beam generated mask
- emitter mask
- emulsion mask
- etch ing mask
- etch mask
- etch-resistantmask
- etch-resistmask
- evaporation mask
- exposure mask
- fault injection mask
- faultless mask
- field-oxidemask
- fieldmask
- fine-line mask
- gold mask
- grid mask
- hard-surface mask
- high-contrast X-ray mask
- high-flatness mask
- high-transmission X-ray mask
- IC mask
- in situ mask
- insulator mask
- interconnection mask
- ion-beam stencil mask
- ion-implantation mask
- iron-oxide mask
- isolation mask
- layered mask
- lithographic mask
- master mask
- metal mask
- metal etched mask
- metallization etching mask
- metal-on-glass mask
- metal-on-polymer mask
- moving mask
- multi-pinhole mask
- native охide mask
- negative mask
- nonerodible mask
- offset mask
- optical mask
- optical gate mask
- overlaid mask
- oxidation mask
- oxygen-impermeable mask
- pattern mask
- pattern transfer mask
- photolithographic mask
- photoresist mask
- plating mask
- production mask
- programmingmask
- programmask
- projection mask
- p-well mask
- quartz mask
- refractory mask
- resistor-body mask
- reticle mask
- self-aligned mask
- sputter mask
- stencil mask
- step-and-repeat mask
- thick-film screen mask
- thin-film mask
- trench mask
- vacuum-deposition mask
- work mask
- X-ray lithography mask
- X-ray mask
- 1x mask
- 1:1 mask
См. также в других словарях:
Shallow trench isolation — (STI), also known as Box Isolation Technique , is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers… … Wikipedia
Grabenisolation — Die Grabenisolation (englisch shallow trench isolation, STI, auch box isolation technique) ist ein Verfahren der Halbleitertechnik zur elektrischen Isolation einzelner Bauelemente (hauptsächlich MIS Feldeffekttransistoren) auf integrierten… … Deutsch Wikipedia
DTI — may refer to: Debt to income ratio Deep trench isolation Defense Technology Institute, the Thai defense technology public organisation Department of Trade and Industry, a government department in several countries Detroit, Toledo and Ironton… … Wikipedia
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Chemical-mechanical planarization — Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Contents 1 Description 2… … Wikipedia
LOCOS-Prozess — LOCOS, kurz für englisch Local Oxidation of Silicon (dt. »lokale Oxidation von Silicium«, ist in der Halbleitertechnik ein Verfahren zur elektrischen Isolation von Bauelementen (meist Transistoren). Dafür wird der Silicium Wafer an… … Deutsch Wikipedia
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Old Man of Coniston — Old Man of Coniston … Wikipedia
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international relations — a branch of political science dealing with the relations between nations. [1970 75] * * * Study of the relations of states with each other and with international organizations and certain subnational entities (e.g., bureaucracies and political… … Universalium
France — /frans, frahns/; Fr. /frddahonns/, n. 1. Anatole /ann nann tawl /, (Jacques Anatole Thibault), 1844 1924, French novelist and essayist: Nobel prize 1921. 2. a republic in W Europe. 58,470,421; 212,736 sq. mi. (550,985 sq. km). Cap.: Paris. 3.… … Universalium